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  • Optimizing Mixed Signal Circuit Designs

    Optimizing Mixed Signal Circuit Designs

    Navigating the analog and digital worlds.  READ MORE...

  • Developing Organizational Culture for Troubleshooting

    Developing Organizational Culture for Troubleshooting

    Solving problems and adding value.  READ MORE...

  • Cloud Collaboration

    Cloud Collaboration

    Real-time breakdowns cost more than you think.  READ MORE...

  • The Experts' Take on AI

    The Experts' Take on AI

    What’s working now and what’s not (but should be).
      READ MORE...

  • Designing for High-Pin Count Devices

    Designing for High-Pin Count Devices

    Overcoming “anywhere but here.”  READ MORE...

  • Bluetooth Design

    Bluetooth Design

    6 steps for limiting interference and data loss.  READ MORE...

Homepage Slideshow

  • Optimizing Mixed Signal Circuit Designs

    Navigating the analog and digital worlds.

    https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/18794-optimizing-mixed-signal-circuit-designs

  • Developing Organizational Culture for Troubleshooting

    Solving problems and adding value.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18798-developing-organizational-culture-for-troubleshooting

  • Cloud Collaboration

    Real-time breakdowns cost more than you think.

    https://www.pcdandf.com/pcdesign/index.php/current-issue/289-best-practices/18796-cloud-collaboration-avoiding-pcb-design-chaos

  • The Experts' Take on AI

    What’s working now and what’s not (but should be).


    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18760-ai-in-electronics-manufacturing-what-s-working-now-what-s-not-but-should-be

  • Designing for High-Pin Count Devices

    Overcoming “anywhere but here.”

    https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/18755-designing-for-high-pin-count-devices

  • Bluetooth Design

    6 steps for limiting interference and data loss.

    https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18758-bluetooth-circuit-board-design-guidelines

Tweets by @FrancesStewart5
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  • Park Electrochemical Introduces N7000-3 Polyimide

MAGAZINE

Park Electrochemical Introduces N7000-3 Polyimide

Published: 10 November 2011
 by Staff

N7000-3 polyimide laminate material complements N7000-3 prepreg. Has a UL 94V-1 designation, with no visible bromine. Is a high-Tg polyimide using toughened resin chemistry. For use in applications that require fine geometry, multilayer construction or extreme reliability.

Park Electrochemical Corp., www.parkelectro.com

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