August 2012

 

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FEATURES

CAM
CAM in the Cloud
A handful of PCB industry veterans are vying to be the first to offer pre-CAM analysis through the cloud. But will users prefers a pay-as-you-go model?
by Mike Buetow

Plating
Successful Formulation of ENIG Plating
As Pb-free solder can leave bumps on the traces during HASL (hot air solder leveling), many alternate surface finish processes have been investigated to overcome this challenge. Several formulations of ENIG plating have been tried. A successful formulation of ENIG in continuous use in volume production for more than two years is discussed.
by Dr. T.S. Krishna Ram

 

FIRST PERSON

  • Caveat Lector
    Why Apple will revive onshoring.
    Mike Buetow


MONEY MATTERS

  • ROI
    "Details to follow."
    Peter Bigelow

  • Focus on Business
    Long live the King.
    Susan Mucha

 

TECH TALK

  • Designer’s Notebook
    Reconsidering fiducials.
    Duane Benson

  • In Flex
    Flexible engineering.
    Jay Desai

  • Technical Abstracts
    In case you missed it.

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