January 2013 cover

 

FEATURES

Upverter
Designing Hardware in the Cloud
A startup company leveraging online collaborative tools to perform printed circuit design using a web browser and, in doing so, driving what it says is the first real technology transformation since Windows.
by Mike Buetow

Thermal Management
Direct Thermal Exchange and Its Impact on LED Heat Removal
A cutting-edge PCB construction methodology for highly-efficient heat removal or thermal dissipation creates a direct thermal path conduction capability and reduces LED junction temperature far more efficiently when compared to traditional FR-4, metal core or aluminum PCB constructions.
by Pratish Patel

High-Speed Backplanes
Predictability and Efficient Initial Backplane PCB Fabrication

The total signal loss is the combination of the losses by the conductor and dielectric laminate, and a successful design requires understanding SI design and low-loss material properties.
by Carl F. Hornig

Moisture Protection
Influences on Barrier Performance of UV/EB Cured Polymers.
by Joshua M. Oliver and Dale S. Babcock

 

FIRST PERSON

Caveat Lecto

Let’s get small.

  • Mike Buetow

 

TECH TALK

  • On the Forefront
    25 and counting.
    E. Jan Vardaman

  • Designer’s Notebook
    Stifling emissions.
    Patrick Carrier

  • ESD Basics
    Getting the Most from ESD Standards.
    The ESD Association

  • The Flexperts
    How many layers?
    Mark Verbrugge

  • Moisture Protection
    Influences on Barrier Performance of UV/EB Cured Polymers
    Joshua M. Oliver and Dale S. Babcock

  • Technical Abstracts
    In case you missed it.

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