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Homepage Slideshow

May 2013 Issue

Published: 01 May 2013
 by Staff

May 2013 cover

 

FEATURES

PCB Layout
Will a Via Fit in Between?
BGAs have never been easy to route, but with 0.3mm versions coming, via-in-pad becomes a consideration.
by Duane Benson

Thermal Management
Cool Runnings
The ongoing push to integrate mechanical and electrical design has now extended to electronics cooling simulation.
by Mike Buetow

 

FIRST PERSON

 

MONEY MATTERS

  • ROI
    Rigid-flex.
    Peter Bigelow

 

TECH TALK

  • Designer’s Notebook
    Simulation accuracy.
    Patrick Carrier

  • The Flexperts
    Sticky situations.
    Mark Verbrugge

  • Tech Tips
    ‘Board’ talk.
    Robert Dervaes

  • Technical Abstracts
    In case you missed it.

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