Controlled Impedance on High-Speed Flex PCBs
Front-end analysis can help estimate the proper hatch opening. READ MORE...
Via-in-Pad and Wrap Plating
How and why to achieve higher-density placement and routing. READ MORE...
Concurrent Development
The designer’s role in keeping projects on track. READ MORE...
AI in PCB Design
It’s already here. READ MORE...
Homepage Slideshow
Front-end analysis can help estimate the proper hatch opening.
https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18596-controlled-impedance-on-high-speed-flex-pcbs
How and why to achieve higher-density placement and routing.
https://www.pcdandf.com/pcdesign/index.php/editorial/menu-features/18597-the-via-in-pad-and-wrap-plating-process
The designer’s role in keeping projects on track.
https://www.pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/18593-closing-the-deal-on-concurrent-development
It’s already here.
https://www.pcdandf.com/pcdesign/index.php/current-issue/289-best-practices/18594-ai-in-pcb-design-it-s-already-here
Printed Circuit Design & Fab Magazine
Paste particle size can influence solder printability, but not as much as nanocoating.
The bigger the blob, the easier the job.
Kapton tape can stop solder from coming up unmasked vias.
Or what the @#$% is a squircle, and what is it doing on my stencil?
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