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Kent Balius

A top-down approach for reducing error-prone and time-intensive manual operations.

Last month we talked about the often ambiguous, unstructured design data packages running rampant in the PCB industry, which drive non-value-add administrative tasks across all phases of our data exchange and processes, and we underscored the urgency to integrate “smart engineering” data-driven processes, as becoming more efficient as an industry in reducing cost and NPI cycles should be a critical objective to all organizations. What exactly do we mean when we talk about smart engineering or data-driven processes? Buzzwords and acronyms are all around us, such as digital transformation, RPA (repetitive or robotic process automation), BPM (business process management), SaaS (software as a service), etc. All encompass a similar objective: optimizing our processes throughout the enterprise.

In the PCB manufacturing facility, some classic examples of duplicated data entry when receiving a new design package are in the front-end engineering process steps (FIGURE 1). Several generic steps occur across the industry, and all of these must occur, with the sequence varying based on the company or manufacturing facility. In many cases, each of these process steps are completely segregated software applications, which in essence results in non-value-added administrative tasks.

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Kent Balius

After 40 years, it’s past time we overhauled our data package processes.

The concept of “smart engineering” has been a major focus of mine these past few years. In the 35 years I have been in the PCB industry, I’ve come to the conclusion we are stuck in a quagmire of unintelligent, unstructured and, frankly, 40-year-old technology of exchanging design data packages. The impact is repetitive, mindless, non-value-add administrative tasks across all facets of the industry. The problem has only been exacerbated with increased technology. All this negatively impacts labor costs, quality and NPI lead times.

Manual and duplicate data entry are the norm, with thousands of keystrokes and mouse clicks performed throughout the process. From quote to pre-CAM, planning methods and CAM, quality checks are abundant. One mistyped character or digit could potentially result in 100% scrap of the product. I’ve watched patiently as many industry proposals for intelligent and structured data packages have come and gone. The waiting has been daunting. We have invested millions of dollars on enhanced software applications for CAM, CAD and engineering to streamline and achieve efficiency and productivity. While these investments and initiatives certainly have improved productivity and cycle times, we are still enveloped in an extensive human-dependent, high-labor-cost operation with extravagant administrative tasks. This has and continues to be our reality.

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Read more: Kiss the Mouse Click Goodbye

To close the gap in IC substrates, buyers need skin in the game.

The CHIPS Act was passed more than a year ago and not one federal dollar has yet to be awarded – although private industry has committed and started to spend billions. Once funded, the new, more advanced foundries will take years to build and start operations.

When produced, however, the chips will be useless until they are packaged and mounted on PCB platforms. The facilities, materials and knowhow to produce the substrates used to package them remain primarily in Asia – including China.

Notably, the cost to build and equip the necessary substrate and PCB facilities to produce HDI and UHDI (ultra-HDI) circuitry in volume is substantially more than that of a typical PCB or flex circuit factory, but far less than that needed for a foundry.

To provide incentives, US Representatives Blake Moore (R-UT) and Anna Eshoo (D-CA) this year introduced H.R.3249 – Protecting Circuit Boards and Substrates Act. This bill is the second iteration of this effort and has a long way to go in gaining cosponsors and approval.

Creating sustainable Western PCB and substrate sources will take time, and will not necessarily be in the country of use. Today just a handful of American and Western companies have the technology to produce some level of UHDI circuitry. To develop a secure source, the US will need more than government words, resolutions, bills and funds with heavy ropes (not just strings) attached: It needs active OEM investment and participation.

Read more: PCB Industry Needs OEMs to ‘Chip’ In

Gene WeinerThe PCB East keynoter gives a roundup of innovative technologies to come out of the pandemic.

We have gone where no mask has gone before! The Printed Circuit Engineering Association (PCEA) held its first regional conference and exhibition in Marlborough, MA, in April.

A resurrected PCB East drew attendees from as far as the West Coast and Florida. There is nothing like in-person contact. The social aspect of networking has been missing for far too long. The enthusiasm of the attendees bodes well for future face-to-face regional gatherings.

It was great to see so many old friends in the real world, while meeting new young engineers and entrepreneurs such as Yitzi Ehrenberg and David Kanarfogel of Conformant, who have developed a new additive circuit process based on an innovative CVD system.

IPC and retired industry legend Dr. Laura Turbini joined many notable attendees, including Dr. Hayao Nakahara, Anaya Vardya, John Vaughan, Chrys Shea and Peter Bigelow, president of the SMTA Boston Chapter.

Read more: Covid Class Creations

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