Current Issue

Duane Benson

When choosing smaller parts, consider ImAg or ENIG instead.

Read more: HAL: For Big Parts Only

 Duane Benson

It all comes down to contrast and positional accuracy.

Read more: What Makes a Good Fiducial?

John Berrie

Using buildup layers and premium FPGAs to deal with SI challenges.

Read more: Return Vias, Buildup Layers and the Latest FPGAs

Duane Benson

 

 

 

 

 

 

 

Mask the pins to keep solder where it belongs.

Read more: Surface Mount Power Component Footprints

Page 84 of 214