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COVER STORY
Practical Design of Differential Vias
A scalable, topology-based equivalent circuit model can accurately match via behavior to a bandwidth well above the application bandwidth, typically above 10 GHz. A look at a very simple way of modeling a differential via and translating its geometry into an equivalent circuit model.
by Eric Bogatin, Bert Simonovich and Yazi Cao
DfF
Are Your PCB Data Unprepared?
It is great to have a fabricator that can provide its “secret sauce” to make the design work, but be ready to get locked into that supplier, because another fabricator’s recipe will be different. As a designer, is that a risk you want to take?
by Jeff Champa
Global Sourcing
China’s labor shortage.
Tom Coghlan
ROI
Hello? Anyone there?
Peter Bigelow
Designer's Notebook
Modules with castellated mounting holes.
Duane Benson
On the Forefront
Packaging over chips.
E. Jan Vardaman
Better Manufacturing
The missing link.
James Fuller
Tech Tips
Can DoD crack RoHS plating armor?
ACI Technologies Inc.
Technical Abstracts
In case you missed it.
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The Year of Staying Employed
The aging (graying, some say) of the printed circuit board design field continues, or so says our annual survey of the industry. What 400 designers have to say about their chances for survival in the era of automation and outsourcing.
By Chelsey Drysdale
SEA/NPI Awards
A pictorial look at some of the 2010 winners of the CIRCUITS ASSEMBLY Service Excellence Awards (SEA) for best-in-class customer service and the PCD&F/CIRCUITS ASSEMBLY New Product Introduction (NPI) Awards for the best new product during the past 12 months.
Caveat Lector
Ride with Jeff.
Mike Buetow
Database
One designer’s winning pitch.
Pete Waddell
Competency confusion.
Peter Bigelow
Final Finishes
No masking these changes.
Lenora Toscano
Cover Story
Frequency Loss Effect of Conductor Profile on the Insertion Loss, Phase Constant and Dispersion in Thin High Frequency Transmission Lines
Increasing conductor roughness alone increases the effective Dk in thin circuitry by up to 15%, while substantially increasing dispersion.
Allen F. Horn III, Ph.D., John W. Reynolds, Patricia A. LaFrance and James C. Rautio, Ph.D.
RF Design
Choosing an RF Design Environment Flow
You can’t build a house without blueprints. So why do so many RF design flows try to build a board without a schematic?
by Abby Monaco
Cautious Optimism in China
Exhibitors were cautious rather than shell-shocked, and even with a wobbly recovery underway, they have seen a marked increase in business.
by Matthew Holzmann
Memory Interface Speed Solutions
Higher performance requirements reduce timing margins on interfaces, thus imposing strict rules on board routing.
by Hal Katircioglu
New Year, New Outlook
An uptick in attendance on the floor overshadowed a lack of innovations in the booths.
By Mike Buetow and Chelsey Drysdale
First Person
EMS hot for LED.
Mike Buetow
Sayonara, electronics engineering?
Pete Waddell
Money Matters
Printed electronics: process revolution?
Randall Sherman
ROI
Bad grades.
Peter Bigelow
Tech Talk
On the Forefront
Inside the iPad.
E. Jan Vardaman
Designer’s Notebook
It’s the data, stupid!
Michael Dreyer
Process Improvement
The DfM Continuum
Design and manufacturing often are thought of as separate processes, with some interdependencies. But absent a feedback loop, development will be marred by unnecessary defects and re-spins.
by John Isaac and Bruce Isbell
Signal Integrity
Open 'Eyes' in the Frequency Domain
Although final performance is measured in the time domain, a detour may be the faster route to a signal integrity solution.
by Dr. Eric Bogatin
Materials Engineering
Heat Transfer in LED Assembly
LEDs may seem cool to the touch, but they all produce heat. So while they offer significant benefits over filament and fluorescent lighting, dissipating heat within an LED assembly involves the selection and use of thermally conductive and (usually) electrically insulating materials.
by Chuck Neve
Sherman's Market
No more dips for chips.
Sandra Winkler
Database
Back to school.
Pete Waddell
ROI
Fixing process improvement.
Peter Bigelow
Focus on Business
Improve workers' lives, improve the bottom line.
Susan Mucha
Real World EMC
Designing out radiated emissions.
Dr. Eric Bogatin
Final Finishes
Process flow and routine analysis.
Lenora Toscano
Getting Lean
Balancing tradeoffs of waste elimination.
Ryan Wooten
Technical Abstracts
In case you missed it.
Off the Shelf
Impedance Control
Accurate Impedance Control, Part II
Choosing the right method for determining impedance control of multi-GHz or multi-Gb boards.
by Istvan Nagy
Signal Integrity
Designing PCBs with High-Speed Constraints
SI rules must take into account signal quality, timing and crosstalk.
by Patrick Carrier
Cover Story
Could Printed Electronics Replace Traditional Electronics?
Over the next 10 years, printed electronics will make gains in RFID, displays, packaging, ICs, and alternative energy. But a glorious future isn't set in stone.
by Randall Sherman
CIRCUITS ASSEMBLY Top 50
The Trials of 2009
When it comes time to write the story of the EMS industry in 2009, foremost will be the effects of the recession. The subtext, however, will be the dramatic fall of Elcoteq, whose final chapter is still being written. Plus: The 50 largest EMS companies.
by Mike Buetow
Database
Scary thoughts on DfM.
Pete Waddell
Global Sourcing
Getting vertical.
Rex Green
ROI
Merger mania strikes again.
Peter Bigelow
Designer's Notebook
Defining PDN impedance.
Dr. Zhen Mu
On the Forefront
Can Japan stay committed to R&D?
E. Jan Vardaman
Tech Tips
Component reliability for RF applications.
ACI Technologies Inc.
Solar Technologies
Frontside silver conductor line efficiency.
Tom Falcon
Off the Shelf