PCD&F February 2010 cover

FEATURES

  • DfA
    Component Layout in Placement Processes
    Effective, accurate component placement takes into account the best practices of design and assembly, both of them inextricably intertwined. Positioning CSPs and noise-sensitive devices are two of a host of considerations.
    by Zulki Khan

  • Copper Plating
    Improved Electrolytic Copper Plating for Flex PWBs
    A novel electrolytic copper-plating process is said to provide flex circuit manufacturers a new option for meeting system performance requirements, while maintaining or improving product interconnection and mechanical reliability.
    by Hiroshi Hoshiyama, Shinjiroh Hayashi, Makoto Sakai and Rikiya Shimizu

  • CAD-CAM
    PCB Data Preparation
    What happens to CAD data once it is released to manufacturing? A veteran designer describes what happens to a typical job once it leaves his facility and reaches manufacturing.
    by Jack Olson and Mike Tucker

FIRST PERSON

MONEY MATTERS

  • Global Sourcing
    When offshoring works best.
    Rob Duvall

  • ROI
    Back to basics.
    Peter Bigelow

TECH TALK

  • EMC for the Real World
    Grover on inductance.
    Dr. Eric Bogatin

  • The Defects Database
    Rethinking black pad.
    Dr. Davide Di Maio, Ph.D.

  • Test and Inspection
    IEEE test standards 'speed' toward resolution.
    Jun Balangue

  • Getting Lean
    Sequentially implementing Lean and Lean Sigma.
    Carlos Rodriguez

 

DEPARTMENTS

Off the Shelf

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