Why a relatively unknown technology might be right for static bend applications.
Working with semi-flexible PCBs has opened some unique opportunities that I believe are worth exploring. The idea behind semi-flex is simple yet effective: a circuit that can flex without the high cost associated with using polyimide materials, which are typically necessary for full flexibility. This means the PCB can handle moderate bending without the expense of materials traditionally required for a fully flexible circuit. In multiple scenarios, once I’ve introduced this technology to customers, they’ve fully embraced it and have incorporated it into their PCB designs many times over, replacing rigid-flex designs for limited or static bend applications.
Despite the advantages, semi-flex is still a relatively unknown technology. A small group of people understand what it is and use it regularly, but for most, it’s completely new, and they’re often amazed by the possibilities it brings. Many customers light up when they see how a semi-flexible circuit could work in their applications, especially since it brings flex into the rigid realm. This permits flexible applications while leveraging the manufacturing techniques of a typical multilayer or HDI factory. It’s a major advantage because, unlike fully flexible PCBs, semi-flexible boards don’t require specialized facilities, which can drive up costs and narrow production options.
How the industry standard revolutionizes PCB collaboration.
Last month’s column talked about a simpler way to exchange stackups with manufacturing partners. This month, continuing the theme of migrating from handoffs to bidirectional design data exchange, we will talk about electronic exchange of technical queries with design/manufacturing partners through IPC-2581’s DfX module. The module may be included within the design data or exist independently, such as a stackup exchange module that can be shared separately.
A simpler, smarter way to get stackups right the first time.
For years, we talked about “handing off” design data to manufacturing partners. Many still do. The handoff model is simple: design sends “build intent” in one direction, usually through a mix of emails, spreadsheets, PowerPoints and Word documents.
How to limit shared design data, protecting IP and securing the manufacturing handoff.
Last month’s column on intelligent data transfer discussed how PCB design data have evolved from unintelligent, fragmented formats like Gerber to an intelligent, integrated, single-file exchange through IPC-2581. We talked about what intelligent data means – design data that retains their full context, hierarchy and relationships throughout the product lifecycle – and why the industry needs to move away from legacy Gerber-based packages.