After 40 years, it’s past time we overhauled our data package processes.
The concept of “smart engineering” has been a major focus of mine these past few years. In the 35 years I have been in the PCB industry, I’ve come to the conclusion we are stuck in a quagmire of unintelligent, unstructured and, frankly, 40-year-old technology of exchanging design data packages. The impact is repetitive, mindless, non-value-add administrative tasks across all facets of the industry. The problem has only been exacerbated with increased technology. All this negatively impacts labor costs, quality and NPI lead times.
Manual and duplicate data entry are the norm, with thousands of keystrokes and mouse clicks performed throughout the process. From quote to pre-CAM, planning methods and CAM, quality checks are abundant. One mistyped character or digit could potentially result in 100% scrap of the product. I’ve watched patiently as many industry proposals for intelligent and structured data packages have come and gone. The waiting has been daunting. We have invested millions of dollars on enhanced software applications for CAM, CAD and engineering to streamline and achieve efficiency and productivity. While these investments and initiatives certainly have improved productivity and cycle times, we are still enveloped in an extensive human-dependent, high-labor-cost operation with extravagant administrative tasks. This has and continues to be our reality.
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To close the gap in IC substrates, buyers need skin in the game.
The CHIPS Act was passed more than a year ago and not one federal dollar has yet to be awarded – although private industry has committed and started to spend billions. Once funded, the new, more advanced foundries will take years to build and start operations.
When produced, however, the chips will be useless until they are packaged and mounted on PCB platforms. The facilities, materials and knowhow to produce the substrates used to package them remain primarily in Asia – including China.
Notably, the cost to build and equip the necessary substrate and PCB facilities to produce HDI and UHDI (ultra-HDI) circuitry in volume is substantially more than that of a typical PCB or flex circuit factory, but far less than that needed for a foundry.
To provide incentives, US Representatives Blake Moore (R-UT) and Anna Eshoo (D-CA) this year introduced H.R.3249 – Protecting Circuit Boards and Substrates Act. This bill is the second iteration of this effort and has a long way to go in gaining cosponsors and approval.
Creating sustainable Western PCB and substrate sources will take time, and will not necessarily be in the country of use. Today just a handful of American and Western companies have the technology to produce some level of UHDI circuitry. To develop a secure source, the US will need more than government words, resolutions, bills and funds with heavy ropes (not just strings) attached: It needs active OEM investment and participation.
The PCB East keynoter gives a roundup of innovative technologies to come out of the pandemic.
We have gone where no mask has gone before! The Printed Circuit Engineering Association (PCEA) held its first regional conference and exhibition in Marlborough, MA, in April.
A resurrected PCB East drew attendees from as far as the West Coast and Florida. There is nothing like in-person contact. The social aspect of networking has been missing for far too long. The enthusiasm of the attendees bodes well for future face-to-face regional gatherings.
It was great to see so many old friends in the real world, while meeting new young engineers and entrepreneurs such as Yitzi Ehrenberg and David Kanarfogel of Conformant, who have developed a new additive circuit process based on an innovative CVD system.
IPC and retired industry legend Dr. Laura Turbini joined many notable attendees, including Dr. Hayao Nakahara, Anaya Vardya, John Vaughan, Chrys Shea and Peter Bigelow, president of the SMTA Boston Chapter.
Here we are in January 2022 with a future fraught with more uncertainties than any other during my six decades in the PCB, IC fabrication and assembly industries.
Business is strong despite shortages in labor and parts. Prices are rising, dramatically in some cases. Profits are being squeezed. Rapid government changes in travel restrictions and worker conditions seem endless due to the continuing evolution of the pandemic.
Supply chains are under pressure from a variety of events and circumstances. These include some brief power shutdowns at plants that produce wafers and PCBs in China, chip and other component shortages, shipping issues with a backlog of over 100 cargo ships carrying, for example, container loads of copper-clad laminates anchored off the Southern California coast waiting to be unloaded. The battery industry is gobbling up copper supplies. Major consumers are buying into chipmakers who can guarantee their needs. This affects those who cannot, causing them to scramble for new sources.
Not only are ICs in short supply, especially for automotive needs with the increase in the manufacture of EVs and hybrids, but substrates are needed for their mounting and connection to the outside world. As a result, major automotive companies in Japan, the US, and Europe have curtailed production in several factories to the tune of several million vehicles in the coming year.
The CHIPS Act was passed more than a year ago and not one federal dollar has yet to be awarded – although private industry has committed and started to spend billions. Once funded, the new, more advanced foundries will take years to build and start operations.
