Etchable gold thick film process for high-definition thick film circuitry is an alternative to thin films.
Neoganth W Pre Dip is for desmear and metallization (PTH) process step for fine-line HDI and package substrate applications.
Library.io creates component outlines for Autodesk Eagle and 3D models that can be used with Fusion360 3D CAD and CAM design software.
FH63 series rugged FPC/FFC connectors offer high-heat resistance for harsh environment applications.