Neoganth W Pre Dip is for desmear and metallization (PTH) process step for fine-line HDI and package substrate applications.
Library.io creates component outlines for Autodesk Eagle and 3D models that can be used with Fusion360 3D CAD and CAM design software.
FH63 series rugged FPC/FFC connectors offer high-heat resistance for harsh environment applications.
DA-6010 nonconductive die attach adhesive for image sensors and circuit assembly (chip on board) applications has a moderate glass transition temperature (Tg) and modulus.
PCB Artist v. 4.0 free design software includes advanced layout capabilities, a library of over 500,000 components, and free technical support.