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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

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  • New Products

New Products

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FH58M FPC connector is 0.25mm pitch. Features a backflip-style actuator and a dual-sided top and bottom.

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NovaRay high bandwidth, high-density interconnect system has a pin-to-ground differential pair configuration said to enable crosstalk to 40 GHz+, tight impedance control, and minimal variance in data rate as stack heights increase.

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AcceleRate HD 0.635mm pitch, multi-row interconnect system provides an ultra-high density interface and next generation bandwidth.

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Free e-commerce version of HyperLynx design rule check (DRC) tool includes eight design rules.

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Super-Sharp option for Quad Tech probes provides an increase in test cell throughput and maintains fidelity of test signal over longer uninterrupted run times for higher yields.

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CST Studio Suite 2018 EM simulation software designs, analyzes and optimizes components and systems across the EM spectrum.

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