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  • Optimizing Mixed Signal Circuit Designs

    Optimizing Mixed Signal Circuit Designs

    Navigating the analog and digital worlds.  READ MORE...

  • Developing Organizational Culture for Troubleshooting

    Developing Organizational Culture for Troubleshooting

    Solving problems and adding value.  READ MORE...

  • Cloud Collaboration

    Cloud Collaboration

    Real-time breakdowns cost more than you think.  READ MORE...

  • The Experts' Take on AI

    The Experts' Take on AI

    What’s working now and what’s not (but should be).
      READ MORE...

  • Designing for High-Pin Count Devices

    Designing for High-Pin Count Devices

    Overcoming “anywhere but here.”  READ MORE...

  • Bluetooth Design

    Bluetooth Design

    6 steps for limiting interference and data loss.  READ MORE...

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  • New Products

New Products

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TWX-40 allows gold deposits up to 8μin in ENIG and ENEPIG processing in a single step.

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KiCad schematic capture and printed circuit board online tool now includes a beta release of a library consisting of nearly 1,000 common parts for open source use.

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HyperLynx printed circuit board simulation software now performs end-to-end, fully automated serializer/deserializer (SerDes) channel validation.

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AC-7303 copper-clad laminate offers thermal conductivity of 3W/mK, a reported modulus 1/10 that of conventional materials, and flexible dielectric layer (after curing).

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FAB 3000 v. 7 is CAM software runs advanced DRC/DfM verifications, generates component centroids, creates SMT stencil pads, panelizes PCBs, and performs other useful features.

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RO4460G2 low-loss bondply has a 6.15 dielectric constant (Dk).

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