IT-8338A and IT-8350A are for use in antenna and LNB applications.

IT-8338A has nominal dielectric constant of 3.38 ±0.04 and dissipation factor of 0.0038 @ 10GHz. IT-8350A has nominal dielectric constant of 3.50 ±0.04 and dissipation factor of 0.004 @ 10GHz. Are based on thermoset systems with Tg of 185°C and Td higher than 360°C. Reportedly offer excellent dimensional stability because of thermoset makeup. Stable DK/Df with temperature and humidity; TCDK is ~35 ppm/°C. Immunity to oxidation and issues related to thermal aging. Full prepreg offering is available. Are suitable for hybrids and offer ability to make package high-layer-count boards. RTF and HTE copper options are standard; Rz2 and Rz1 copper options, with surface roughness <2 and <1 micrometer, respectively, are available. Can use very low profile (VLP) copper for reduced insertion loss and PIM. Laminate offering includes 20-, 30-, and 60-mil thick laminates and optional thinner laminates.

ITEQ Corp.
iteq.com.tw/?lang=en

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