Log in / Register
  • ENEPIG Corrosion Mechanisms

    ENEPIG Corrosion Mechanisms

    Different types of nickel corrosion and potential mitigation strategies.
      READ MORE...

  • The Future is Thin, Flat and Flexible

    The Future is Thin, Flat and Flexible

    What’s ahead for antennas, heaters and inks.
      READ MORE...

  • Royalty Flush

    Royalty Flush

    A noted solutions architect offers an audacious plan for AI acceptance. It just might work.
      READ MORE...

  • Rocking and Rolling at ZIW

    Rocking and Rolling at ZIW

    The annual user event was tuned into AI, but that’s not the only melody being played.
      READ MORE...

  • Can Thailand Pad its PCB Gains?

    Can Thailand Pad its PCB Gains?

    2023 saw only a handful of fabricators gain ground, but SE Asia is primed to boom.
      READ MORE...

Homepage Slideshow

ITEQ Launches IT-8338A, IT-8350A FR-4

Published: 23 October 2018

IT-8338A and IT-8350A are for use in antenna and LNB applications.

IT-8338A has nominal dielectric constant of 3.38 ±0.04 and dissipation factor of 0.0038 @ 10GHz. IT-8350A has nominal dielectric constant of 3.50 ±0.04 and dissipation factor of 0.004 @ 10GHz. Are based on thermoset systems with Tg of 185°C and Td higher than 360°C. Reportedly offer excellent dimensional stability because of thermoset makeup. Stable DK/Df with temperature and humidity; TCDK is ~35 ppm/°C. Immunity to oxidation and issues related to thermal aging. Full prepreg offering is available. Are suitable for hybrids and offer ability to make package high-layer-count boards. RTF and HTE copper options are standard; Rz2 and Rz1 copper options, with surface roughness <2 and <1 micrometer, respectively, are available. Can use very low profile (VLP) copper for reduced insertion loss and PIM. Laminate offering includes 20-, 30-, and 60-mil thick laminates and optional thinner laminates.

ITEQ Corp.
iteq.com.tw/?lang=en

 

Submit to FacebookSubmit to Google PlusSubmit to TwitterSubmit to LinkedInPrint Article