λ-Bridge (Lambda-Bridge) series thermal conductors are constructed with aluminum nitride or beryllium oxide materials.

Provide thermal management in four EIA form factors: 0302, 0402, 0603, and 0805. Designed to direct heat to thermal ground planes, heat sinks, or other points of thermal interest. Help protect adjacent components from hot-spot thermal loads. Exhibit high thermal conductivity, low thermal resistance, and low capacitance. Feature RoHS-compliant SMT packages compatible with automated pick-and-place processing. Are reportedly ideal for use between active-device and adjacent ground planes, between a specific contact pad and case or between contact pads, and as direct component contacts in GaN power amplifiers, high-power RF amplifiers, filters, synthesizers, industrial computers, switch-mode power supplies, and pin and laser diodes. Exhibit thermal resistance values spanning 10°C/W to 25°C/W (T1) and 16°C/W to 32°C/W (T2); thermal conductivity values spanning 40mW/°C to 100mW/°C (T1) and 30mW/°C to 60mW/°C (T2); and capacitance values spanning 0.06–0.13pF (T1) and 0.05–0.08pF for edge-wrap versions. Non-wrapped versions have lower capacitance values.

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