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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

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  • New Products

New Products

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Carbon Zebra connector makes electrical contact using 140 conductive pads per in. when placed between PCB and LCD display.

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Amalga enables fabrication of hollow, metal waveguide and coaxial structures inside and on top of electronic substrates.

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IM series high-frequency laminates are passive intermodulation (PIM) performing version of AD300D, AD255C, and DiClad 880 antenna grade laminates.

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AD300D 4th gen. commercial microwave and RF laminate material extends capabilities of AD300 product.

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BR series raised element through-hole current sense resistors have 1W, 3W, and 5W power ratings.

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CU4000 and CU4000 LoPro foils are sheeted foil options for designers looking for foil lamination builds.

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