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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

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  • New Products

New Products

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R-1785 glass composite printed circuit board material (CEM-3 grade) improves mounting reliability of PCB parts, contributing to stability of automotive and industrial equipment.

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R-G545L/R-G545E, Prepreg R-G540L/R-G540E circuit board material is suitable for semiconductor packages and modules.

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HD-EFI product series has 50Ω micro-miniature interface, said to be ideal for blind-mate situations and mating multiple RF lines between printed circuit boards.

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fastRise EZpure low-temperature curing adhesive is for rigid and flex PWBs.

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Sarcon 30XR-m is a high-performance thermal interface material that exhibits low thermal resistance.

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A307DC visual inspection system offers fully automated defect detection.

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