tec-speed 20.0 high-frequency laminate and prepreg series is a ceramic-filled hydrocarbon thermoset material for such printed circuit board applications as cellular base station antennas, power amplifiers, LNB for broadcast satellites, automotive radar and RFID.

TWLS and TZA electrodeposited copper foils are now arsenic-free. All traces of arsenic have been removed from the treatment process.

XJTAG DFT Assistant free software interface for Mentor Xpedition Designer increases design for test and debug capabilities of the schematic capture and PCB design environment.

BondFilm HF is for treatment of innerlayer cores.