MacuSpec VF-TH 200 is a DC electrolytic copper metallization process for simultaneous via filling and through-hole plating.
The 14 Gbps FireFly FMC Module includes a two-piece Firefly SMT connector system, meets VITA 57.1 form factor, and is capable of transmitting and receiving 14 Gpbs over 10 channels.
Telotech TS Black is a blackening process that reduces visibility of copper conductors on transparent substrates like PET.
Cupratech TS D3 electroless copper process permits additive buildup of copper meshes based on catalytic palladium or silver layers.