Arlon raPId polyimide substrates are for streamlining manufacturing and improving performance of flexible heater applications.

Incorporate benefits of polyimide heater dielectrics with flexibility and usability of silicone adhesive system. Reportedly replace traditional acrylic or fluorinated ethylene propylene (FEP) adhesive systems; combine polyimide film with silicone adhesive that processes in less time and at lower temperatures and pressure. Thermosetting silicone adhesive system locks foil-etched circuit in place. Available in etched-foil and wire-wound dielectric offerings. Ideal for high-reliability applications. Can be used to maintain temperatures in analytical test equipment with a chemical-resistant heater or in outdoor electronics requiring cold weather operation via ultra-low-profile heater constructions. Attractive for low-weight heaters for aerospace applications and for medical equipment.

Rogers Corporation
rogerscorp.com

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