What is Ultra HDI?
With Ultra HDI, small features come with big decisions. READ MORE...
The Critical Nature of PCB Stackup
The stackup supports every layer above it. READ MORE...
The PCB Design Review Process
A structured design review process ensures alignment. READ MORE...
Metal-Core PCBs and Thermal Management
Catch heat at the board. READ MORE...
Homepage Slideshow
With Ultra HDI, small features come with big decisions.
https://pcdandf.com/pcdesign/index.php/editorial/menu-features/19043-ultra-hdi-what-is-it-and-how-is-it-different-than-hdi
The stackup supports every layer above it.
https://pcdandf.com/pcdesign/index.php/editorial/menu-features/19042-the-critical-nature-of-pcb-stackup-and-how-to-build-an-efficient-one
A structured design review process ensures alignment.
https://pcdandf.com/pcdesign/index.php/current-issue/241-designer-s-notebook/19037-reviewing-the-pcb-design-review-process
Catch heat at the board.
https://pcdandf.com/pcdesign/index.php/current-issue/293-board-talk/19039-metal-core-pcbs-and-thermal-management
Printed Circuit Design & Fab Magazine
CU4000 and CU4000 LoPro foils are sheeted foil options for designers looking for foil lamination builds.
Provide good outer layer adhesion when used with RO4000 products.Rogers Corporationrogerscorp.com
View the DigitalEdition Here!