New Products

BM23PF series hybrid connector features signal contacts rated to 0.3A and power contacts rated to 5A.

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Standard and custom anodes for electroplating are used in applications including surface preparation for electronic interconnects.

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Ventec mobile tec-APP has a new and intuitive user interface, for up-to-the-minute information on all developments, technical data updates, ongoing projects and news from Ventec's operations across the world. Includes latest data sheets and process guidelines.

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Online Reference Gerber Viewer version 1.5 now features multilayer support, allowing multiple files to be visualized simultaneously; improved security; support for new block nesting commands (AB, LM, LR, LS); and support for all file extensions.

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RFS-100 optical registration and bonding system performs pinless lamination of rigid and rigid-flex multilayers.

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Visper 8 inspects very thin PCBs (0.007–0.04”) such as flex circuits and HDI boards.

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