Sherlock automated design analysis software v. 5.4 includes temperature-based FEA, materials library expansion, component failure modes, and a Sqlite parts library option. 

Arlon raPId polyimide substrates are for streamlining manufacturing and improving performance of flexible heater applications.

XYR-03-01 alignment stage is a high-resolution, high-repeatability x-y-theta stage for wafer alignment, semiconductor handling, laser cutting and drilling.

HDTF substrates can incorporate conductor multilayers.