BMP-4 board marker probe is for installation on bare board or loaded board test fixtures.

Ultra Dimension PCB AOI integrates leading pattern inspection, laser via inspection, Remote Multi-Image Verification (RMIV) and 2D metrology. Uses varied light settings and three different types of images to improve detection capabilities, reduce false alarms and decrease inspection setup time.

Field Solver Sandbox provides provides quick, accurate impedance and insertion–loss results.

Z-planner v. 1.0 field-solver-based PCB stackup planning and materials selection tool is optimized for hardware engineering teams that may or may not be familiar with exhaustive details of laminate and PCB fabrication processes.