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  • The Trade Show Connection

    The Trade Show Connection

    Finding community amid chaos.  READ MORE...

  • Understanding ANOVA

    Understanding ANOVA

    Analyzing process data for accurate, defensible decisions.  READ MORE...

  • High Yield Design Practices

    High Yield Design Practices

    Building with manufacturing limits in mind.  READ MORE...

  • Rigid-Flex Design

    Rigid-Flex Design

    Rigid-flex technology is redefining electronics design.  READ MORE...

  • PCB Thermal Challenges

    PCB Thermal Challenges

    When passive heat management isn’t enough.  READ MORE...

  • NTI-100: The World’s Top PCB Fabricators

    NTI-100: The World’s Top PCB Fabricators

    The changing map of PCB production.  READ MORE...

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New Products

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HyperLynx printed circuit board simulation software now performs end-to-end, fully automated serializer/deserializer (SerDes) channel validation.

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AC-7303 copper-clad laminate offers thermal conductivity of 3W/mK, a reported modulus 1/10 that of conventional materials, and flexible dielectric layer (after curing).

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FAB 3000 v. 7 is CAM software runs advanced DRC/DfM verifications, generates component centroids, creates SMT stencil pads, panelizes PCBs, and performs other useful features.

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RO4460G2 low-loss bondply has a 6.15 dielectric constant (Dk).

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SiP-id software is said to reduce design iterations and improve throughput, reducing time needed to design and verify ultra-complex SiP packages.

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OrCAD Capture Cloud, a free, web-based subset of the OrCAD Capture schematic design, is now integrated with Ultra Librarian, providing a cloud-based design tool that is fully scalable to a professional, production-ready printed circuit board design solution.

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