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  • What is Ultra HDI?

    What is Ultra HDI?

    With Ultra HDI, small features come with big decisions.  READ MORE...

  • The Critical Nature of PCB Stackup

    The Critical Nature of PCB Stackup

    The stackup supports every layer above it.  READ MORE...

  • The PCB Design Review Process

    The PCB Design Review Process

    A structured design review process ensures alignment.  READ MORE...

  • Metal-Core PCBs and Thermal Management

    Metal-Core PCBs and Thermal Management

    Catch heat at the board.  READ MORE...

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New Products

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BR series raised element through-hole current sense resistors have 1W, 3W, and 5W power ratings.

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CU4000 and CU4000 LoPro foils are sheeted foil options for designers looking for foil lamination builds.

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RO4450T bonding materials are 3.2-3.3Dk, low loss, spread-glass reinforced, and ceramic-filled.

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RO4835T laminates are offered in 2.5 mil, 3 mil and 4 mil core thicknesses, are 3.3 Dk, low loss, spread-glass reinforced, ceramic-filled thermoset materials.

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Sherlock automated design analysis software v. 5.4 includes temperature-based FEA, materials library expansion, component failure modes, and a Sqlite parts library option. 

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Arlon raPId polyimide substrates are for streamlining manufacturing and improving performance of flexible heater applications.

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