New Products

BondFilm HF is for treatment of innerlayer cores.

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Electra v. 7.20 shape-based autorouter has improved completion rate and quality for high-density designs.

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9176-800 series low-profile insulation displacement connectors reduce Z-axis height of 9176-400 series 1mm; reduce volume of standard 00-9176 series IDCs more than 50%.

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Carbon Zebra connector makes electrical contact using 140 conductive pads per in. when placed between PCB and LCD display.

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Amalga enables fabrication of hollow, metal waveguide and coaxial structures inside and on top of electronic substrates.

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IM series high-frequency laminates are passive intermodulation (PIM) performing version of AD300D, AD255C, and DiClad 880 antenna grade laminates.

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