KiCad schematic capture and printed circuit board online tool now includes a beta release of a library consisting of nearly 1,000 common parts for open source use.
HyperLynx printed circuit board simulation software now performs end-to-end, fully automated serializer/deserializer (SerDes) channel validation.
AC-7303 copper-clad laminate offers thermal conductivity of 3W/mK, a reported modulus 1/10 that of conventional materials, and flexible dielectric layer (after curing).
FAB 3000 v. 7 is CAM software runs advanced DRC/DfM verifications, generates component centroids, creates SMT stencil pads, panelizes PCBs, and performs other useful features.
SiP-id software is said to reduce design iterations and improve throughput, reducing time needed to design and verify ultra-complex SiP packages.