New Products

Stanna-COF immersion tin enables chip-on-film (CoF) technology.

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Cupracid Flex and InPro Flex are designed for standard conformal flex applications.

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tec-speed 20.0 high-frequency laminate and prepreg series is a ceramic-filled hydrocarbon thermoset material for such printed circuit board applications as cellular base station antennas, power amplifiers, LNB for broadcast satellites, automotive radar and RFID.

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TWLS and TZA electrodeposited copper foils are now arsenic-free. All traces of arsenic have been removed from the treatment process.

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XJTAG DFT Assistant free software interface for Mentor Xpedition Designer increases design for test and debug capabilities of the schematic capture and PCB design environment.

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BondFilm HF is for treatment of innerlayer cores.

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