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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

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  • New Products

New Products

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Near zero-ohm SOT23 Jumper components short out PCB circuitry without the need to redesign or spin new boards.

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tec-speed 20.0 ceramic-filled hydrocarbon thermoset material series now comes in four new low passive intermodulation (PIM) antenna-grade versions: L300, L330, L340 and H348.

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Comprehensive video training library includes 77 of IPC’s most popular video training titles as a subscription or as mini-libraries focused on hand soldering, electronic assembly inspection, electronic and wire assembly and electrostatic discharge fundamentals.

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ECXML (Electronics Cooling XML) open neutral file format makes it possible to share design models among different thermal simulation toolsets.

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Nitrile ESD gloves complement Nitrile ESD and Latex ESD finger cots.

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Narrow-pitch connectors use tough-contact technology and include flat printed circuit and flexible flat cable connectors, as well as board-to-board and board-to-FPC types.

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