New Products

Coeur CST high-current interconnect system features a float design that accommodates pin to socket misalignment, allowing for ease of mating PCB to PCB, PCB to bus bar, or bus bar to bus bar without risk of overstress damage to socket contact system.

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XRF plating thickness instruments now have extended stage option.

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Release 2018 for CAM350, BluePrint-PCB, and DFMStream delivers 3D technology for PCB post-processing, including manufacturing data visualization, stack-up definition, PCB panel visualization and support for 3-D PCB documentation.

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Flat Fan Rinsing Nozzles, manufactured primarily from polypropylene or PVDF (stainless steel is also available), are engineered for final rinses and come in “water saver” models as low as 0.2gpm.

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Printoganth RA horizontal electroless copper process was developed to ensure blister-free electroless copper deposition and shiny surface appearance after electrolytic copper plating.

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InPlan 5.5 software is for panelization of rigid and flex PCBs.

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