Z-planner Enterprise 2019.2 is a field-solver-based stackup planning and material selection software optimized for front-to-back PCB design and signal-integrity flow.
Enables design and validation of PCB stackups. Provides interfaces to common PCB layout and signal-integrity design flows, as well as large dielectric materials library. Can perform all aspects of PCB stackup planning, design, and validation. Reportedly reduces time to specify and validate fabricator stackups. Features include full accounting for frequency, resin content, glass style, and pressed prepreg thickness; unlimited stackup layer support, including automated calculation of width and spacing; HyperLynx field solver – simulating impedance, as well as dielectric and copper losses; automated impedance goal-seeking across multiple stackup signal layers; glass awareness and glass-weave skew prevention; DFM and DFSI rules, management and checking. Can compare multiple PCB fabricator stackups to design specifications. Stackup Manager allows for stackup reuse, tracking layer count, impedance groups, and signal/power/ground layer assignments. Includes built-in library filters for common constraints like halogen-free materials, dual-ply cores, and IPC-4101 slash sheets. Custom library filters use any mechanical or electrical material parameters. Offers access to Z-solver, a cross-section analysis tool, Z-zero laminate library, a Material Mapper.
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