RO3003G2 high-frequency laminates provide radar sensor designers with improved insertion loss and reduced dielectric constant (Dk) variation.

HSEC8 series high-speed edge card socket on 0.8mm pitch now has option of signal and power card edge combo connector.

Z-Planner v. 2018.1 PCB stackup software includes 14 new features and 12 new laminate systems.

Ultraminiature, thin-film transmission line capacitors have novel metal-insulator-metal (MIM) structure and a range of capacitance values. for high-frequency links, DC blocking in the UHF range (300MHz – 3GHz), and other high-performance microwave and RF applications.