Clarity 3D solver reportedly delivers up to 10x faster simulation performance and unbounded capacity compared to legacy field solver technology.
Harnesses distributed multiprocessing technology to tackle electromagnetic challenges encountered when designing 3D structures on chips, packages, PCBs, connectors and cables. Reads design data from all standard chip, IC package and PCB implementation platforms. Addresses EM challenges faced when designing systems for 5G communications, automotive/ADAS, HPC and IoT applications. Creates accurate S-parameter models for use in signal integrity, power integrity and electromagnetic compatibility analysis. In conjunction with Cadence Sigrity 3D Workbench, users can merge mechanical structures such as cables and connectors with their system design and model the electrical-mechanical interconnect as a single model. Integrates with Virtuoso, Cadence SiP layout and Allegro implementation platforms.