BM23PF series hybrid connector features signal contacts rated to 0.3A and power contacts rated to 5A.

Is available in stack height of 0.8mm with 10, 14, 20, 24, 30, 40, 42, 46, & 54 contact options. Standard signal only BM23FR version is rated to 0.3A. Is available in two stack heights, including 0.6mm and 0.8mm. The 0.8mm stack height is available in 10, 18, and 60 contacts. The 0.6mm stack height is available in 6, 8, 10, 12, 16, 20, 24, 30, 30, 40, and 50 contacts. Both versions support USB 3.1 gen. 2 and provide transmission speeds up to 10Gbps. BM23 series FPC-to-board connectors have pitch of 0.35mm, depth of 1.98mm, and fast transmission speeds. Metal solder retention tabs provide strong PCB retention and prevent housing damage if connector is mismated. Deliver breaking strength of 90N. Have two-point U-shaped contact design. Use guide ribs that provide self-alignment up to 0.4mm in the pitch direction and 0.3mm in the width direction. Rated voltage is 30V AC/DC; rated current is 0.3A; contact resistance is 100milliohm max.; insulation resistance is 50 Megaohm min., and operating temperature is -55 °C to +85 °C. Can be used in digital cameras, portable audio players, portable gaming devices, laptops, smartphones, tablets, and wearable devices.

Hirose
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