FEATURES
Thermal management is becoming a common limiting factor in newer technologies.
Ed.: This is the fifth of an occasional series by the authors of the 2017 iNEMI Roadmap. This information is excerpted from the Roadmap, which is available from iNEMI (http://community.inemi.org/content.asp?contentid=51).
Digital camera manufacturers continue to decrease their manufacturing space due to the steady decline in camera sales.
Advancement in model-based system engineering was one of many highlights at the Zuken Innovation World conference in San Diego.
POPULAR
- 7 Habits of Highly Efficient PCB Designers
- Designing Printed Circuit Boards for the Internet of Things
- Via-in-Pad Design Considerations for Bottom Terminated Components on PCB Assemblies
- How to Ensure Your Design Complies with Complex Flex Circuit Design-for-Manufacturing Requirements
- Designing a Successful High-Speed Rigid-Flex PCB