FEATURES

With multiple assemblers involved in most projects, how can you speed up the development process?

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During the 1980s, high-density flexible circuit manufacturers ran around the barn a few times trying to decide the best way to produce a reliable bond strength between polyimide sheets and copper foils when producing thin copper laminates for high density flexible circuits.

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Flexibility, preparation and passion are an effective combination.

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Stop thinking such traces must be a certain width!

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Odd-layer-count boards are not only manufacturable, but at times preferable.

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Can vias carry considerably more current than was previously known? 

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