Features

The annual user event was tuned into AI, but that’s not the only melody being played.

Zuken welcomed customers and partners to Cleveland in September for the electronics design software company’s annual users event, providing an opportunity for networking and a backstage pass to the company’s most recent software updates and future innovations.

Zuken Innovation World Americas, colocated with Vitech’s Integrate24, opened with comments from Kent McLeroth and Enrique Krajmalnik, the chief executives of Zuken USA and Vitech, respectively, and a keynote address befitting its location in the supposed birthplace of rock and roll with Mark Schulman, drummer for such artists as P!NK, Billy Idol, Foreigner and Cher.

Read more ...

2023 saw only a handful of fabricators gain ground, but SE Asia is primed to boom.

Small it was, but the Thailand Electronics Circuit Asia exhibition held in Bangkok in late July was extremely informative as to what is happening in the Southeast Asian nation. According to the Thailand Board of Investment (BOI), the PCB output in Thailand may become the third or even second largest in the world. From 2022 to 2026, about $6 billion to $7 billion will be invested in PCB capacity in Thailand (at this moment, 40-plus fabricators from Taiwan and China are pouring into Thailand). Calling Thailand the second-largest PCB-producing country may be a bit of a stretch, but the third largest is not an exaggeration. From the view of “nationality,” however, Thailand-based KCE and a few other small ones will account for less than 10% of the total output. Taiwan-, China- and Japan-based companies will hold the lion’s share of the PCB output in Thailand.

Read more ...

Nine considerations to prevent signal degradation due to crosstalk and EMI.

With demand growing for AI chips the need for high-speed PCBs is on the rise. As operating frequencies increase over 10GHz, the risk of reflections, crosstalk and EMI increases.

For optimal performance, all frequency components of a signal should maintain consistent amplitude changes. Additionally, signals must reach their destination simultaneously to prevent phase discrepancies. Understanding these aspects will help the design of circuits without signal distortion.

Read more ...

A symmetrical build is one of the keys to minimize board warpage.

A stackup’s construction should be balanced to keep board warpage within IPC specifications. In general, the following parameters must be symmetrical with respect to a fictitious center plane of the board:

  • Dielectric thickness
  • Buildup of the dielectric
  • Pattern density (layer to layer)
  • Thickness of copper foil
  • Number of layers.
Read more ...

Can a production fabricator thrive in Middle America? Through its novel automation, Summit’s Chicago plant is proof-positive.

In 1979, Eagle Electronics laid its foundation in printed circuit board manufacturing, and by 1985, it established its current site in Schaumburg, IL, just a few miles from Chicago’s O’Hare Airport. The journey since then has been one of resilience and transformation, a pivotal moment coming in 2001 when the company faced a crucial decision: close its doors, become a broker or remodel. The decision to overhaul operations marked a new chapter, altering workflows to the point where work-in-progress inventory became a rare occurrence.

Read more ...

Tips and tricks for applications of all speeds, from 1MHz to gigabit level.

How do you know a high-speed design application from an ordinary one? What qualifies as high speed and when does design rigor need ramping?

With CAD tools available to help enforce design rules and the internet at one’s fingertips, PCB designers may implement “best practice” techniques without truly understanding their importance. They may also be missing some less common, powerful and effective techniques as well.

Here we target a broad range of designers and discuss the gamut of lower-speed designs up to gigabit-level speeds. We cover board-level tips and tricks and explain why these tips are important and the nature of the physics behind them. Whether you’re designing with simple I2C or gigabit ethernet, there’s something to be gained by considering even the simplest additions to a design.

Read more ...

Page 3 of 85

Subcategories