EMI/RFI Testing Survival Kit investigates and tests EMI/RFI shielding materials. Includes magnetic field probe; electric field probe; EMI/RFI demo fixture; materials samples, and cables and probes. Sample materials include nickel on copper-plated polyester fabric tape with conductive adhesive; embossed foil tape; aluminum foil tape with conductive adhesive; tin-plated copper foil tape with conductive adhesive; EMI absorber materials; EMI gasket material, and polyester laminated aluminum foil tape with conductive adhesive. Also includes samples of die-cut materials.
Fabrico, www.fabrico.com
MultiClad HF halogen-free, low-loss thermoset laminate and prepreg system is for microwave and high-frequency printed circuit boards.
Sphinx advanced analysis kits for printed circuit board signal integrity simulation include a 2+ hr. video seminar on designing for signal and power integrity covering the basics of SI/PI integrity, interaction between signal and power, identifying return path discontinuities, advanced concepts and a reliable methodology for reaching fast and accurate design closure; a copy of “Power Integrity Modeling and Design for Semiconductors and Systems”; applications videos to help resolve problems commonly found in today’s designs; a 30-day evaluation license of Sphinx or Sphinx for Signoff.
E-System Design, www.e-systemdesign.com
Indx v 4.1 library management software includes a completely redesigned user interface with significant performance and productivity increases across the entire design team user flow. Includes real-time status display, spreadsheet views that allow batch editing on the fly, quick search and edit, symbol and geometry previews, and complete commit history tracking with versioning. Major new features include all-in-one library manager; edit-in-place library structure; fully packaged parts = auto-packaging + auto-referencing on the fly during placement; 100% legacy data transition with Intercept translators; relational database structure for optimum performance.
Intercept Technology, www.intercept.com/library-management/library-management.html
Voratron electrical encapsulation uses epoxy, polyurethane and other chemistries to meet a wide voltage range for power transmission and distribution equipment. Is said to have excellent thermo-mechanical performance and electrical insulation, for electrical devices, circuitry, transformers, switchgears sensors, capacitors, relays, coils, insulators and components.
Dow Formulated Systems, www.voratron.com
NestLib 2010 R3 includes a new module for PCB fabrication. Is a nesting technology focused on optimizing 2D packaging. Provides high-speed algorithms for fully automated True Shape nesting. Consists of a base module and a set of optional advanced modules. Is available as a static library, dynamic linked library, and COM DLL. Supports Java and .NET. Is available for 32 -bit and 64-bit Microsoft Windows OS, as well as for Sun Solaris and Linux platforms. Can be ported to Mac OS on demand. Supports multi-core computing for dual core and quad core computers.
Geometric, www.geometricglobal.com