Printed Circuit Design & Fab Online Magazine - New Products

New Products

Aldec Active-HDL FPGA design and simulation bundles are for OrCAD users. Provide multi-language design entry and simulation for FPGA logic. Provide tools to handle the increasing complexity of FPGA development. Deliver a scalable vendor-independent platform to accommodate complex mixed-language FPGA verification tasks. Provide a speed increase and contain no limitations on design size.

EMA Design Automation, Inc., www.ema-eda.com

CAMMaster is for complex CAM and PCB manufacturing. CAMMaster Designer is a CAD companion tool that simplifies difficult tasks such as layer compare and netlist compare. Netlist extraction and DRC functions reportedly set the industry standard. Can merge data by board layer, reducing the information to a minimal set of polygons. These polygons can be converted to F type outlines to edit, and then back to polygons. Can merge multiple designs and panelize jobs.

Pentalogix, www.pentalogix.com

DuPont 7723 low-temperature firing silver conductive ink is suitable for printing on glass. Adheres to ITO coated glass, and is Pb-free and solderable.
DuPont 9169 is a low-temperature curing Ag ink designed for flexible substrates. Has extremely high conductivity, strong adhesion to ITO coated flexible substrates, low contact resistance to ITO, and fine line capability. Are for touch screens and OLEDs.

DuPont Microcircuit Materials, http://www2.dupont.com/MCM/en_US/

Pyralux TK flexible circuit material is a copper-clad laminate and bonding film specifically formulated with Teflon fluoropolymer film and Kapton polyimide film for high-speed digital and high-frequency applications. Contains no glass. Dk is 2.3 to 2.7; Df is 0.002 or 0.003, depending on the film construction. Is designed for high-speed flex applications, including microstrip and stripline-controlled impedance constructions. A variety of copper foil weights are available: standard foils are 18 and 35 µm rolled annealed copper. Is a layered dielectric. Teflon is also available separately as a sheet adhesive. Comes in laminate thicknesses of 50, 75 and 100 µm. Bondply thicknesses are available in 75 or 100 µm.

DuPont Circuit and Packaging Materials, www.DuPont.com

Halogen-free Embedded Capacitance Material is said to improve power integrity and reduce electromagnetic interference. Is compatible with standard rigid and flexible PCB processing, including laser drilling. Is RoHS compliant. Is a thin, high-performance capacitor laminate that can be embedded into PCBs and computer chip packages to reduce impedance, power bus noise, PCB EMI and discrete capacitor count.

3M Electronic Solutions Division, www.3Mcapacitance.com

Embedded Capacitance Materials simulation model is for use in HFSS and SIwave software. Is said to address noise issues early in the design cycle by incorporating the ECM into design simulations, resulting in fewer design spins. Is a thin, high-performance embedded capacitor laminate that helps reduce impedance, power bus noise, EMI and discrete capacitor count. Is compatible with most rigid and flex PCB processing, including laser drilling.

3M Electronic Solutions Division, http://www.ansoft.com/products/hf/hfss/3MEmbeddedCapacitanceMaterial.cfm
ANSYS Inc., www.ansys.com