HDI Stackup Planning Tool enables creation of complex HDI PCB stackups in one day. Helps create a robust PCB design with great manufacturability and operational characteristics.

Sierra Circuits, www.protoexpress.com/content/fineLine.jsp

MWI-2010 Microwave Impedance Calculator is available for free download at www.rogerscorp.com/acm. Is supplied as an executable file that will run on any Windows-compatible PC. Provides quick calculations of key transmission-line parameters based on the use of extensive lines of high-frequency circuit materials. Uses closed-form equations; can calculate the impedance of high-frequency conductors based on a variety of transmission-line technologies, including microstrip and stripline, and laminate materials. Provides on-screen menus in selections of transmission-line technology, material, material thickness, conductor thickness, and other parameters. Menus list materials and relative dielectric constants, dissipation (loss) factors, thermal conductivity, and thermal coefficient of dielectric constant.

Rogers Corp., www.rogerscorp.com

GHS-51 high-speed electrolytic process is said to prevent whisker formation in electroplated tin for 22,000 hr. Sissipates compressive stress, preventing whisker formation. Uses a high purity anode, suited for connectors and semiconductor leadframes. Offers high deposition speeds for rackless and reel-to-reel processing, and high deposition efficiency over a wide current density range. Bath is lead- and fluoride-free, and foam-resistant. Operating range 113-131^oF, with 122^o the optimum. Film has uniform white matte appearance. Carbon and sulfur concentrations in the film are very low, and control over liquid level is easy. Is reportedly heat-resistant, with excellent solderability.

Uyemura International Corp., www.uyemura.com

Three compact, high-amperage, ROHS-compliant RADSOK PCB connectors are for power bus applications such as high-power bus assembly utilities, power-to-board servers, power-to-box servers, and battery power/chargers for electric vehicles. Use a hyperbolic, stamped grid configuration that ensures a large, coaxial, face-to-face surface area engagement. Provide the option of bringing power to the board from busbars suspended above or below the board and its components. Come in press-fit and solder versions; available in either a 0.094" size and rated for as much as 35A, or a 0.141" size and rated for as much as 70A. For board thicknesses of 0.250" +/-0.025", with custom sizes available.

Amphenol Industrial, www.amphenol-aerospace.com