Advanced Design System 2011 Momentum solves power integrity problems complicated by heavily perforated power and ground planes. Contains full wave 3-D multilayer electromagnetic field solver that yields power distribution network impedance for an arbitrary input mixture of power, ground and signal nets on each layer. Results said to be valid into the multi-gigahertz range. Can be applied to heavily perforated printed circuit boards and high-frequency IC package power integrity problems. Includes a signal integrity/power integrity analyzer that provides a simple net-based electromagnetic simulation setup wizard and automatic test-bench generator for typical SI/PI circuit simulations. Models wire bonds, the effects of frequency-dependent dielectric loss and the surface roughness of copper traces.

Agilent Technologies, www.agilent.com/find/ADS_PI_images

Sphinx DC simulator provides DC analysis for IC package and PCB designs. Is based on multilayer finite difference methodology; enables quick identification of problem areas in designs. Can import designs, edit them, prepare them for simulation, and run frequency and DC analysis in parallel on one database. Ensures design has suitable DC levels available at voltage and ground terminals; has DC voltage levels that do not cause premature reliability issues; can be simulated in DC system level simulation by providing a condensed Spice circuit; avoids unexpected Joule heating effects; avoids signal voltage drops that cause receiver latching failures.

E-System Design, www.e-systemdesign.com

Osmond PCB for Macintosh v. 1.1.7 enhances via type selection and improves trace cut-and-paste. Remembers window size and position. Automatically saves changed designs. Designed for budget users.

Osmond PCB, www.osmondpcb.com

Altium Designer 10 compares schematic revisions graphically. Optimizes component selection based on lifecycle status, part failure traceability, design source traceability, and more. Features include 3-D "flyovers" for viewing the design, high-end routing capability, FPGA-board co-design, smart data management.