RO4460 prepreg coupled with RO4360 laminate is said to feature a dielectric constant of 6.15 ±0.15 and dielectric loss of 0.003 at 2.5 GHz.

HFSS and Pantheon PCB/Hybrid/RF layout design application have an enhanced bidirectional link. Design can begin either in HFSS or layout, with the latest improvements further automating transfer of design intelligence. Reportedly saves considerable time during RF design; design cycle times are reduced by half or more.

Intercept Technology, www.intercept.com/solutions/rf-design.html

DSEC Series high-speed dual-stack edge-card socket accepts two 1.6 mm-thick PCB cards. This 0.8 mm pitch system, in a right-angled configuration, permits dual-stacked cards at 7 mm spacing between cards. Available with 30, 40 or 50 edge-rate contacts per row. Is optimized for signal integrity and impedance control, high cycles, reduced broadside coupling, and low insertion and withdrawal force. Pb-free solder charge terminations for easy board processing are standard; SnPb solder charges optional. Additional card spacings and an elevated single-card system also available.

Samtec, www.samtec.com

EP Doctor CAM enables simulation, design, and manufacturing of high-precision embedded passive components in RF PCBs. Uses a learning model to adapt to individual PCB manufacturing processes to produce high-precision components without the need for corrective laser trimming. 

Troops First Research Initiative Inc., www.tfriinc.com