ECP SiP embedded component packaging technology enables system-in-package devices. Is for integrating active and passive components into PCBs. Used in products that need to fit the largest possible number of features into the smallest possible space.

AT&S, www.ats.net

Four-ply, peel-n-stick FPDSEM 90 cooling patch reduces chip and circuit temperature by as much as 11% without the need for a heatsink. Thermal material radiates heat from an electronic component to the surrounding environment. Apply patch like a sticker to the surface of any hot spot. Can be custom cut or trimmed to fit virtually any shape. Provides a thermal conductivity of 1.5 W/m°K and a thermal emissivity of 0.97. Is 25 mm thick and can be ordered in sheets, rolls or kiss-cut rolls.

Fujipoly America Corp., www.fujipoly.com

Advanced Sweller process chemistry has a wide operational window. Handles normal and high performance laminates, using sustainable solvent and low operating concentrations.

Dow Electronic Materials, www.dow.com

Advanced SAP Metallization semi-additive process chemistry includes neutralizer, conditioner and electroless copper. Provides high dielectric adhesion with low roughness, plating coverage on both via bottom and surface, excellent bath stability and reliability performance for ultra fine lines.

Dow Electronic Materials, www.dow.com