Si9000e transmission line field solver now adds surface-modeling of both sides of copper printed circuit board layers into insertion-loss calculations. Models matte and drum surfaces of copper layers. Is compatible with Polar Speedstack layer stackup design tool. Can import material Er and Tan delta over multiple frequencies. Boundary-element method field solver models more than 100 PCB transmission line structures. Predicts impedance, attenuation, RLGC, and S-parameters with frequencies ranging from a few kHz up to the point where the line ceases to operate in TEM mode, typically around 100GHz. Can explore “what if” scenarios for rapid simulation of the impact of different materials and geometries. Can document complex stackups in minutes. Can be used in pre-layout design, reference chipset stackup design and post-layout modeling of impedance and insertion loss.

Polar Instruments, www.polarinstruments.com

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