GenClad 280 bond-ply is a woven fiberglass-reinforced, ceramic-filled composite material for multilayer RF and high-frequency printed circuit boards. Combines a non-polar thermoset resin system with controlled-expansion ceramic filler and a low-loss thermoplastic material. Is engineered for use in bonding dissimilar and hard-to-bond materials in multilayer PCB structures, particularly in high-speed and microwave applications. Is compatible with PTFE laminate materials; prepreg processes in conventional FR-4 lamination cycles. Has a low dielectric constant and loss (2.8/0.002 at 10 GHz); low water absorption (0.04%); stable dielectric constant over frequency and temperature; excellent adhesion to a variety of PTFE and other RF/microwave cores; high decomposition temperature (443°C) and T288 (>60 sec) for Pb-free solder compatibility; low Z-direction CTE (45-50 ppm/°C) for enhanced PTH reliability, and is RoHS compliant.

Arlon Material for Electronics, www.arlon-med.com 

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