Flexible EL system is formed on polyester films. Each EL sheet layer, excluding the ITO layer, is produced using an advanced screen printing process. Layers are less than 15 µm thick and are flexible because of organic binder materials. Total sheet thickness can be as little as 100 µm. Come in blue, pink and yellow. Produces flexible light sources and signage.
DKN Research, www.dknresearch.com
AlphaSTAR 420R prevents creep and flaking corrosion seen in harsh PWB service environments. Is used as a final post-treatment step in the AlphaSTAR PWB immersion silver process. Is formulated to enhance corrosion resistance and deliver a tarnish-free surface. Is water-soluble. Penetrates micropores.
Enthone Inc., www.enthone.com
XT/duroid thermoplastic laminate materials are for high-frequency multilayer circuits. Feature thin halogen-free dielectrics and come with low-profile copper foil cladding bonded directly to the dielectric without the use of adhesives, for low insertion loss. Are flame-retardant and thermally and chemically robust with high melting points and low outgassing. Feature a z-axis Dk of 3.23 ±0.05 at 10 GHz and a dissipation factor of 0.0035 or less at 10 GHz. Thermal coefficient of dielectric constant (TCK) is +7 ppm/°C from -50° to +150°C. They also exhibit excellent thermal conductivity of 0.35 W/m/°K. Estimated maximum operating temperature exceeds 210°C. Are compatible with lead-free-solder assembly methods.
Rogers, www.rogerscorp.com
Craneboard is an ARM-based development board that offers open source PCB and design. Uses Beagleboard support and resources. Is based on TI's AM35x Sitara ARM Cortex-A8 MPU; features include PoE and CAN bus interfaces. Offers numerous integrated peripherals and provides power-over-DC wall adapter, PoE enabled by TI's TPS23750 PoE controller and USB, which permits portability. Expansion port permits adding functionality such as an LCD panel, along with wireless and audio capabilities, and is compatible with other ARM Cortex-A8 open source boards.
Mistral Solutions, www.mistralsolutions.com
RT/duroid 6035HTC high-thermal-conductivity laminate is for low loss in high-power circuits. Fluoropolymer composite material is for RF and microwave applications. Features relative Dk of 3.5 at 10 GHz, thermal conductivity of 1.44 W/mK and loss tangent of 0.0013 at 10 GHz. Is said to have superior heat-transfer characteristics. Fabricated with thermally stable, reverse-treated and electrodeposited copper foils. Supports clean drill holes with minimal tool wear. Available in a variety of dielectric thicknesses and cladding options.
Rogers Corp., www.rogerscorp.com
Eagle v. 5.11 CAD incorporates new functionality for automatic search and online pricing and availability. Setup and save options now available for individual order lists for schematics, and lists can be added to a shopping cart. Manufacturer libraries are now supplied with order codes. Has three main elements: schematic, layout and autorouter.
CadSoft Computer, www.premierfarnell.com