MaxVIA plasma treatment system treats a variety of panel sizes and types. Provides high throughput and plasma uniformity in desmear and etchback applications for high density interconnect, flexible, and rigid circuit board manufacturing. Offers expanded plasma chamber to accommodate large panel sizes of up to 24 x 42"; has a throughput capacity of 92 to 138 units per hr., depending on panel size. Uses 75% less volume of CF4 gas than other systems for desmear applications. 

Nordson March, www.nordsonmarch.com

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