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  • Material Selection for High-Speed PCBs

    Material Selection for High-Speed PCBs

    Consider return loss and insertion loss – but don’t stop there.  READ MORE...

  • Characterizing Etchback and Dielectric Loss Tangent

    Characterizing Etchback and Dielectric Loss Tangent

    Fabrication-aware simulations to aid PCB design success.  READ MORE...

  • Sequential Lamination in PCB Manufacturing

    Sequential Lamination in PCB Manufacturing

    Manufacturing high-layer count boards.  READ MORE...

  • Implementing Flash Memory in PCB Design

    Implementing Flash Memory in PCB Design

    Routing flash has EMI implications.   READ MORE...

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  • New Products

New Products

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Sarcon GR-SL is a low compression and high-performance thermal gap filler material.

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MK11-O printed circuit board plasma system is said to produce fast etch rates and cycle times.

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MULINO, OR -- Printed circuit board prototype manufacturer Sunstone Circuits has added SMT stencils to its product line.

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STMicroelectronics and Microchip Technology component libraries come with complete schematic symbols and printed circuit board footprints.

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E³.series electrical CAD software suite for engineering, design, documentation and manufacturing wiring harnesses, cable assemblies and other electrical gear performs first phase electrical planning in the same software environment as schematic, harness, fluid and panel design.

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ICD Stackup Planner - HDI Designer Edition impedance calculator/stackup planner includes multiple differential pair definitions per layer.

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