New Products

Thick Panel Copper Plating, for electrolytic plating, enhances throwing power for very thick (over 3.2 mm thickness) panel plating. High Speed Direct Current Copper Plating improves throwing power at increased plating densities on high aspect ratio and microvia boards. Are said to increase plating efficiency and obtain higher productivity without the need for extra equipment.

Dow Electronics Materials, www.dow.com

Silveron MF 100 autocatalytic silver with immersion gold is a replacement for immersion silver and ENEPIG (electroless nickel electroless palladium immersion gold). Has a dense silver coating to prevent diffusion of copper to the silver surface and reduce copper oxide formation. Provides solderability and gold wire bondability.

Dow Electronics Materials, www.dow.com

Aurolectroless SMT 520 ImAu finish reportedly permits operation at low gold salt concentrations to reduce gold consumption in ENIG processes. Is said to provides deposit coverage to increase corrosion resistance during subsequent process steps.

Dow Electronics Materials, www.dow.com

LCP Laminates are adhesiveless and film-based, for semiconductor packages and coreless designs up to 6 layers as well as in combination with other rigid materials as hybrid circuits. Start with Rogers Ultralam 3000 materials, for low dielectric constant and dissipation factor for RF designs. Tolerate high levels of radiation exposure

Endicott Interconnect Technologies, www.eitny.com

 

 

Fabric Shielding Gasket line includes more than 125 profiles and sizes.

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FAB 3000 v.5 CAM software runs DRC/DfM verification, edits and outputs Gerber data, compares nets, merges PCBs, and generates part centroid files.

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