Printed Circuit Design & Fab Online Magazine - New Products

New Products

STMicroelectronics and Microchip Technology component libraries come with complete schematic symbols and printed circuit board footprints.

E³.series electrical CAD software suite for engineering, design, documentation and manufacturing wiring harnesses, cable assemblies and other electrical gear performs first phase electrical planning in the same software environment as schematic, harness, fluid and panel design.

ICD Stackup Planner - HDI Designer Edition impedance calculator/stackup planner includes multiple differential pair definitions per layer.

Studio Suite v. 2011 SP5 offers transient bidirectional co-simulation between cable currents and electromagnetic fields in the surrounding space.

The QFN package design kit for Agilent’s Advanced Design System electronic design automation software is based on MicroLeadFrame packages. Enables mutual Amkor and Agilent customers to improve RFIC/MMIC design quality and time-to-market. Can explore various design specifications with package information and implement optimized RFIC/MMIC designs. Contains models for 3 x 3, 4 x 4, 5 x 5, and 6 x 6 MLF QFNs. All die are scalable; material properties can be modified. Includes scalable models for bond pad arrays and board via arrays.

Amkor, www.amkor.com

Technistan HTM 4089 is a high throw matte tin sulfate process for printed circuit boards. Additive suppresses deposit thickness on the surface, creating a thicker deposit in the center of a high aspect ratio through-hole or at the bottom of a blind microvia with a fine grain deposit. Provides resistance to final etchants. All components are analyzable and stable.

Technic, www.technic.com