LDI 5s Series pushes resolution below 10 µm, for IC packaging production and other fine feature products. Features rotor-based projection system for smooth, continuous scanning, proprietary spatial light modulation, twin-table stage, high bandwidth datapath for improved alignment overlay on individual panels in real time, unique autofocus, and more.

Micronic Mydata AB, www.micronic-mydata.com

RTL Power Model is designed to optimize a wide range of power-sensitive applications, such as ultra-low-power electronics. Predicts integrated circuit power behavior at the RTL level with consideration for how the design is physically implemented; helps enable chip power delivery network and IC package design decisions early in the design process; ensures chip power integrity sign-off for sub-28nm ICs.

Apache Design Inc., www.apache-da.com

Cadstar version 13.0 printed circuit board design software now has improved letter drill drawing creation; improved DXF import; improved routing, and an IDF interface.

RollVIA self-contained vacuum plasma system features roll-to-roll material handling for printed circuit board manufacturing environments.