Cadstar Placement Planner helps communicate intent and provide guidance to the PCB designer.

NI USRP-2920 and NI USRP-2921 instruments offer an educational platform that delivers a hands-on learning experience with real-world signals to RF and communications university labs. Consists of universal software radio peripheral hardware, NI LabVIEW software, and lab-ready course material; exposes students to practical application of abstract mathematical theories. USRP devices feature a software-tunable frontend ranging from 50 MHz to 2.2 GHz or 2.4 GHz and 5 GHz ISM bands. Hardware integrates a software reconfigurable RF transceiver with high-speed A/D and D/A converters; can stream baseband I and Q signals to a host PC over Gigibit Ethernet at up to 20 MS/s for real-time access to the spectrum.

National Instruments, www.ni.com/usrp

Sarcon 50G-Hm is a high-performance, low-resistance gap filler pad manufactured with a low-tac top surface. The one-sided treatment is reportedly less sticky than the opposing surface; thermal pad adheres to target electrical component or opposing heat sink. Provides removal without ripping, warping or damaging the interface material. Transfers heat with a thermal conductivity of 6.0 W/m°K and a low thermal resistance of .16°Cin2/W at 72.5 PSI.  This 0.5mm-thick, flame-retardant TIM is available in sheets up to 300mm x 200mm.

Fujipoly America Corp., www.fujipoly.com

PE-100 Convertible incorporates two individual plasma etching/cleaning type/mode technologies into one standalone plasma etching/cleaning system. Can switch back and forth between RIE anisotropic type etching mode applications and isotropic type etching/cleaning mode applications. Is used for R&D, medical devices, solar cells, nanotechnology, optics, printed circuit boards, MEMs, wafer level packaging, laboratory applications, and other related semiconductor processes.

Plasma Etch, www.plasmaetch.com