Indubond 130N  inductive bonding machine is said to facilitate pin registration for printed circuit board innerlayers. Elastic bonding points withstand movements of innerlayers during hot press cycle. Is said to eliminate internal tensions, thereby reducing warping.

Chemplate Materials, www.chemplate.com

Elpemer SD 2491 SM-TSW solder resist is for application by means of screen printing. Has high resolution of fine details of 75 µm. Is aqueous-alkaline developable. Has good resistance to galvanic and electroless nickel/gold (ENiG), palladium, silver baths and OSP processes. Enables mass soldering and selective soldering simultaneously. Dielectric strength is 70 kV/mm; has a surface resistance of 2 x 10¹⁴ Ohm and a volume resistivity of 10¹⁶ Ohm x cm.

Lackwerke Peters, www.peters.de

Printed circuit folding machine includes two workstations. Has manual load and unload and three simultaneous folding operations in each station. Is used to fold printed circuits. Weighs 350kg.
 
Lazpiur, www.lazpiur.com

Impact 100-Ohm orthogonal direct connector system is designed for a direct connection of printed circuit boards using the same daughtercard. Features options 3- through 6-pair; supports high-speed 25 Gbps data rates. Reportedly eliminates airflow, cross-talk, and capacitance constraints in high-speed channels introduced through current backplane/midplane laminates. Features two compliant-pin attach options and 18 to 72 differential pairs per orthogonal node. Leverages mating interface and compliant-pin technology. Features shorter line cards and switch-module signal paths. Has 2.15mm x 1.35mm grid on both the backplane and daughtercard.

Molex Inc., www.molex.com