Smartlam Model 5000 is designed to laminate a full range of printed circuit boards. Is capable of handling very thin to large heavy panels up to 12.7mm in thickness. Can be used as a pre-tack laminator for inline vacuum processes. Is provided with a data management system. Lamination pressure is adjustable up to 450 Kg; is controlled automatically by proportional valve. Is equipped with brushless servo-motor. Lamination roll temperature is controlled by IR sensor.
Dynachem, http://www.dynachem.eu/products.php?tree_cod=001002
VHF 300 VS horizontal selective via hole filler with vacuum is designed for printed circuit board selective via hole filling, through holes and blind vias. PCB and stencil are placed horizontally onto the filling surface and clamped. Plunger (air pressure controlled) presses paste through stencil into the holes of panel. Paste is stored in reusable cartridges. Different heads are supplied for different panel sizes. Movement of Y-axis is controlled by servo motor. Touch panel display allows up to 50 recipes to be stored. Paste delivery is from a 12 oz, 6 oz, or smaller cartridge. Paste is pressed into the via fill head via pneumatic pressure on the back of the plunger in the cartridge. Pastes used are silver and copper paste (conductive) and epoxy fill (non-conductive). Max panel size is 24" x 30".
MASS, www.mass-pcb.de
Zeta Lam combines Zeta Cap copper clad cured dielectric film and Zeta Bond B-stage adhesive. Foil weights range from 0.25 to 0.375 oz.; comes in 0.0005", 0.001" and 0.0015" thicknesses with adhesive bonds of 0.001" to 0.002".
Integral-HDI, http://www.integral-hdi.com
ALC 500-1 Series is for drilling and routing printed circuit boards that contain aluminum. Is equipped with two spindles with different collet systems: One has a 1/8" shank collet for standard tools and is mainly used for drilling; the other has a collet for 6mm shank tools to provide more stability for the routing process. Routing spindle is equipped with a lubrication system inside of the pressure foot to cool and lubricate tools.
Lenz, http://lenz-gmbh.de/en/products/aluminiumroutingmachine/-series-alc/1.html
SLG free form scoring machine has an automatic tool change system with tool length measurement. Is possible to have different shaped tools in the same program. Board can be scored on both sides simultaneously. Any 2D geometric shape can be scored without turning the board manually. Scoring depth can be set up individually for each side within the program. Exact jump scoring is supported. Bevels can be produced on one side, both sides simultaneously, or inside the printed circuit board. Permits vertical positioning of boards to score thin materials. Panels are located in pins and clamped pneumatically. Smaller PCBs can be arranged on a larger panel and split afterward.
Lenz, http://lenz-gmbh.de/en/products/scoring-machine/series-slg.html
Single Spindle DLG 615-1+1 is for micro-drilling and routing of printed circuit boards. Has separate drill and route spindles selected automatically. Is equipped with two different spindles; both work on PCB and are switched over automatically. Drill spindle is high-speed air-bearing type for drilling micro and medium hole sizes only. Other spindle is a ball-bearing drill and route spindle (10.000 to 60.000 rpm) for drilling large holes and routing. Various drilling spindles are available up to 300,000 rpm.
Lenz, http://lenz-gmbh.de/en/products/drilling-machines/single-spindle-dlg/spindelumschaltung.html